View APTCV60TLM24T3G_894822.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

APTCV60TLM24T3G
Three level inverter CoolMOS & Trench + Field Stop IGBT Power Module
Trench & Field Stop IGBT Q2, Q3: VCES = 600V ; IC = 75A @ Tc = 80C CoolMOSTM Q1, Q4: VDSS = 600V ; ID = 70A @ Tc = 80C
Application * Solar converter * Uninterruptible Power Supplies Features * Q2, Q3 Trench + Field Stop IGBT Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated * * * * * Q1, Q4 CoolMOSTM Ultra low RDSon Low Miller capacitance Ultra low gate charge Avalanche energy rated Very rugged Kelvin emitter for easy drive Very low stray inductance High level of integration Internal thermistor for temperature monitoring
28 27 26 25 29 30
23 22
20 19 18 16 15
31 32 2 3 4 7 8 10 11 12
14 13
All multiple inputs and outputs must be shorted together Example: 10/11/12 ; 7/8 ...
Benefits * Stable temperature behavior * Very rugged * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Easy paralleling due to positive TC of VCEsat * Low profile * RoHS Compliant
October, 2009
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
www.microsemi.com
1 - 13
APTCV60TLM24T3G - Rev 0
All ratings @ Tj = 25C unless otherwise specified
APTCV60TLM24T3G
Q1 & Q4 Absolute maximum ratings
Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy Tc = 25C Tc = 80C Max ratings 600 95 70 260 20 24 462 15 3 1900 Unit V A V m W A mJ
Tc = 25C
Q1 & Q4 Electrical Characteristics
Symbol Characteristic IDSS RDS(on) VGS(th) IGSS Zero Gate Voltage Drain Current Drain - Source on Resistance Gate Threshold Voltage Gate - Source Leakage Current Test Conditions
VGS = 0V,VDS = 600V VGS = 0V,VDS = 600V
Min Tj = 25C Tj = 125C 2.1
Typ
VGS = 10V, ID = 47.5A VGS = VDS, ID = 5mA VGS = 20 V, VDS = 0V
3
Max 350 600 24 3.9 200
Unit A m V nA
Q1 & Q4 Dynamic Characteristics
Symbol Characteristic Ciss Input Capacitance Coss Output Capacitance Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff RthJC Total gate Charge Gate - Source Charge Gate - Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy Junction to Case Thermal Resistance Test Conditions VGS = 0V ; VDS = 25V f = 1MHz VGS = 10V VBus = 300V ID = 95A Inductive Switching (125C) VGS = 10V VBus = 400V ID = 95A RG = 2.5 Inductive switching @ 25C VGS = 10V ; VBus = 400V ID = 95A ; RG = 2.5 Inductive switching @ 125C VGS = 10V ; VBus = 400V ID = 95A ; RG = 2.5 Min Typ 14.4 17 300 68 102 21 30 100 45 1350 1040 2200 1270 0.27 J ns nC Max Unit nF
C/W
www.microsemi.com
2 - 13
APTCV60TLM24T3G - Rev 0
October, 2009
J
APTCV60TLM24T3G
Q2 & Q3 Absolute maximum ratings
Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area TC = 25C TC = 80C TC = 25C TC = 25C TJ = 150C Max ratings 600 100 75 140 20 250 150A @ 550V Unit V A V W
Q2 & Q3 Electrical Characteristics
Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter Saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V, VCE = 600V Tj = 25C VGE =15V IC = 75A Tj = 150C VGE = VCE, IC = 600A VGE = 20V, VCE = 0V Min Typ 1.5 1.7 5.8 Max 250 1.9 6.5 600 Unit A V V nA
5.0
Q2 & Q3 Dynamic Characteristics
Symbol Characteristic Cies Coes Cres QG Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Isc RthJC Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Short Circuit data Junction to Case Thermal Resistance Test Conditions VGE = 0V VCE = 25V f = 1MHz VGE=15V, IC=75A VCE=300V Inductive Switching (25C) VGE = 15V VBus = 300V IC = 75A RG = 4.7 Inductive Switching (150C) VGE = 15V VBus = 300V IC = 75A RG = 4.7 VGE = 15V Tj = 25C VBus = 300V Tj = 150C IC = 75A Tj = 25C RG = 4.7 Tj = 150C VGE 15V ; VBus = 360V tp 6s ; Tj = 150C Min Typ 4620 300 140 0.8 110 45 200 40 120 50 250 60 0.35 0.6 2.2 2.6 380 0.60 ns Max Unit pF C
ns
mJ mJ
October, 2009 APTCV60TLM24T3G - Rev 0
A
C/W
www.microsemi.com
3 - 13
APTCV60TLM24T3G
CR2 & CR3 diode ratings and characteristics
Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF trr Qrr Err RthJC Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy Junction to Case Thermal Resistance IF = 15A IF = 30A IF = 15A IF = 15A VR = 800V IF = 15A VR = 800V Test Conditions VR=1200V Tj = 25C Tj = 125C Tc = 80C Min 1200 Typ Max 100 500 15 2.8 3.4 2.4 240 290 260 960 0.9 2 3.3 V ns nC mJ C/W Unit V A A
di/dt =200A/s
Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 125C
di/dt =1000A/s
CR5 & CR6 diode ratings and characteristics
Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF trr Qrr Err RthJC Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy Junction to Case Thermal Resistance IF = 30A IF = 60A IF = 30A IF = 30A VR = 400V IF = 30A VR = 400V Test Conditions VR=600V Tj = 25C Tj = 125C Tc = 80C Min 600 Typ Max 25 500 30 1.8 2.2 1.5 25 160 35 480 0.6 1.2 2.2 V ns nC mJ C/W Unit V A A
di/dt =200A/s
Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 125C
di/dt =1000A/s
www.microsemi.com
4 - 13
APTCV60TLM24T3G - Rev 0
October, 2009
APTCV60TLM24T3G
CR7 & CR8 diode ratings and characteristics
Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF trr Qrr Err RthJC Symbol R25 R25/R25 B25/85 B/B Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy Junction to Case Thermal Resistance IF = 30A IF = 60A IF = 30A IF = 30A VR = 800V IF = 30A VR = 800V Test Conditions VR=1200V Tj = 25C Tj = 125C Tc = 80C Min 1200 Typ Max 100 500 30 2.6 3.2 1.8 300 380 360 1700 1.6 1.2 3.1 V ns nC mJ C/W Unit V A A
di/dt =200A/s
Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 125C
di/dt =1000A/s
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Characteristic Resistance @ 25C T25 = 298.15 K TC=100C
RT = R25 1 1 RT: Thermistor value at T exp B25 / 85 T - T 25
T: Thermistor temperature
Min
Typ 50 5 3952 4
Max
Unit k % K %
www.microsemi.com
5 - 13
APTCV60TLM24T3G - Rev 0
October, 2009
APTCV60TLM24T3G
Thermal and package characteristics
Symbol VISOL TJ TSTG TC Torque Wt Characteristic
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight
To heatsink
M4
Min 2500 -40 -40 -40 2.5
Typ
Max 175* 125 100 4.7 110
Unit V C N.m g
* Tjmax = 150C for Q1 & Q4
SP3 Package outline (dimensions in mm)
1
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
Q2 & Q3 Typical performance curve
Fmax, Operating Frequency (kHz)
VCE=300V D=50% R G=4.7 T J=1 50C T c =85C
60 45 30 15 0 0 20 40 IC (A) 60
Hard switching
80
100
www.microsemi.com
6 - 13
APTCV60TLM24T3G - Rev 0
October, 2009
Operating Frequency vs Collector Current 75
17 12
28
APTCV60TLM24T3G
Output Characteristics (VGE=15V) Output Characteristics 150
TJ = 150C VGE=19V
150
TJ=25C
125
IC (A)
125
TJ=150C
100 75 50 25 0 0 0.5 1
TJ=25C
100 IC (A) 75 50
VGE=13V VGE=15V
VGE=9V
25 0
1.5 VCE (V)
2
2.5
3
0
0.5
1
1.5 2 VCE (V)
2.5
3
3.5
150 125 100 75 50 25
Transfert Characteristics 5
TJ=25C
Energy losses vs Collector Current
VCE = 300V VGE = 15V RG = 4.7 TJ = 150C Eoff
4 E (mJ) 3 2
IC (A)
TJ=150C
Eon
1
TJ=25C
0 5 6 7 8 9 10 11 12 VGE (V) Switching Energy Losses vs Gate Resistance 5
Eoff
0 0 25 50 75 IC (A) Reverse Bias Safe Operating Area 175 150 100 125 150
4 E (mJ) IC (A)
VCE = 300V VGE =15V IC = 75A TJ = 150C
3 2 1 0 0 5
Eon
125 100 75 50 25 0 40 0
VGE=15V TJ=150C RG=4.7
10 15 20 25 30 Gate Resistance (ohms)
35
100
200
300 400 VCE (V)
500
600
700
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.7 Thermal Impedance (C/W) 0.6 0.5 0.4 0.3 0.2 0.1 0.9 0.7
0.3 0.1 Single Pulse 0.0001 0.001 0.01 0.1 1 10
Rectangular Pulse Duration in Seconds
www.microsemi.com
7 - 13
APTCV60TLM24T3G - Rev 0
0.05 0 0.00001
October, 2009
0.5
APTCV60TLM24T3G
Q1 & Q4 Typical performance curve
0.3 Thermal Impedance (C/W) 0.25 0.2 0.15 0.1 0.05 Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 Single Pulse 0.001 0.01 0.1 1 10
0 0.00001
rectangular Pulse Duration (Seconds) Low Voltage Output Characteristics 720 640 ID, Drain Current (A) 560 480 400 320 240 160 80 0 0 5 10 15 20 25 VDS, Drain to Source Voltage (V) RDS(on) vs Drain Current 1.3 ID, DC Drain Current (A) 1.25 1.2 1.15 1.1 1.05 1 0.95 0.9 0 40 80 120 160 200 240 280 ID, Drain Current (A)
VGS=20V Normalized to VGS=10V @ 95A VGS=10V 5V 4.5V 4V VGS=15&10V
Transfert Characteristics 280 ID, Drain Current (A) 240 200 160 120 80 40 0 0 1 2 3 4 5 6 VGS, Gate to Source Voltage (V) 7
TJ=125C TJ=25C VDS > ID(on)xRDS(on)MAX 250s pulse test @ < 0.5 duty cycle
6.5V 6V 5.5V
RDS(on) Drain to Source ON Resistance
DC Drain Current vs Case Temperature 100 80 60 40 20 0
October, 2009 8 - 13 APTCV60TLM24T3G - Rev 0
25
50 75 100 125 TC, Case Temperature (C)
150
www.microsemi.com
APTCV60TLM24T3G
RDS(on), Drain to Source ON resistance (Normalized) Breakdown Voltage vs Temperature BVDSS, Drain to Source Breakdown Voltage (Normalized) 1.2 1.1 1.0 0.9 0.8 25 50 75 100 125 150 TJ, Junction Temperature (C) Threshold Voltage vs Temperature 1.1 VGS(TH), Threshold Voltage (Normalized) 1.0 0.9 0.8 0.7 0.6 25 50 75 100 125 150 TC, Case Temperature (C) Capacitance vs Drain to Source Voltage 1000000 C, Capacitance (pF) 100000 10000 1000 100 10 0 10 20 30 40 50 VDS, Drain to Source Voltage (V) Crss Coss Ciss 1000 ID, Drain Current (A) ON resistance vs Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 25 50 75 100 125 150 TJ, Junction Temperature (C)
Maximum Safe Operating Area
VGS=10V ID= 95A
100
limited by RDSon
100 s
10
Single pulse TJ=150C TC=25C
1 ms 10 ms
1 1 10 100 1000 VDS, Drain to Source Voltage (V) Gate Charge vs Gate to Source Voltage VGS, Gate to Source Voltage (V) 12 10 8 6 4 2 0 0 40 80 120 160 200 240 280 320 Gate Charge (nC)
VDS=480V
ID=95A TJ=25C
VDS=120V VDS=300V
www.microsemi.com
9 - 13
APTCV60TLM24T3G - Rev 0
October, 2009
APTCV60TLM24T3G
140 120
td(on) and td(off) (ns) Delay Times vs Current 70
td(off) VDS=400V RG=2.5 TJ=125C L=100H td(on)
Rise and Fall times vs Current 60 tr and tf (ns) 50 40 30 20 10 0 tr
VDS=400V RG=2.5 TJ=125C L=100H
100 80 60 40 20 0 0
tf
20 40 60 80 100 120 140 160
ID, Drain Current (A) Switching Energy vs Current
0
20
40
60
80 100 120 140 160
ID, Drain Current (A) Switching Energy vs Gate Resistance 5 Switching Energy (mJ)
VDS=400V ID=95A TJ=125C L=100H
4 Switching Energy (mJ)
3
VDS=400V RG=2.5 TJ=125C L=100H
Eon
4 3 2 1 0
Eoff Eon
2 1
Eoff
0 0 20 40 60 80 100 120 140 160 ID, Drain Current (A)
0
5
10
15
20
25
Gate Resistance (Ohms) Source to Drain Diode Forward Voltage 1000
TJ=150C
Operating Frequency vs Drain Current
VDS=400V D=50% RG=2.5T J=125C T =75C
250 Frequency (kHz) 200 150 100 50 0 10 20
hard switching
IDR, Reverse Drain Current (A)
300
100
TJ=25C
10
1 0.3 0.5 0.7 0.9 1.1 1.3 1.5
October, 2009 10 - 13 APTCV60TLM24T3G - Rev 0
30 40 50 60 70 ID, Drain Current (A)
80
90
VSD, Source to Drain Voltage (V)
www.microsemi.com
APTCV60TLM24T3G
CR5 & CR6 Typical performance curve
Forward Characteristic of diode 80
60 IF (A)
TJ=125C
40
TJ=25C
20
0 0.0 0.4 0.8 1.2 VF (V) 1.6 2.0 2.4
Energy losses vs Collector Current 1 0.75 E (mJ) 0.5 0.25 0 0 20 40 IC (A) 60 80
VCE = 400V VGE = 15V RG = 2.5 TJ = 125C
Switching Energy Losses vs Gate Resistance 1
0.75 E (mJ)
0.5
VCE = 400V VGE =15V IC = 30A TJ = 125C
0.25
0 0 2 4 6 8 Gate Resistance (ohms) 10
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Thermal Impedance (C/W) 1.4 1.2 1 0.8 0.6 0.4 0.2
0.9 0.7 0.5 0.3 0.1 0.05
Single Pulse 0.0001 0.001 0.01 0.1 1 10
0 0.00001
www.microsemi.com
11 - 13
APTCV60TLM24T3G - Rev 0
October, 2009
Rectangular Pulse Duration (Seconds)
APTCV60TLM24T3G
CR7 & CR8 Typical performance curve
Forward Current vs Forward Voltage 80 IF, Forward Current (A)
TJ=125C
60
40
20
TJ=25C
0 0.0 1.0 2.0 3.0 4.0 VF, Anode to Cathode Voltage (V) Energy losses vs Collector Current 2.5 2 E (mJ) E (mJ) 1.5 1 0.5 0 0 20 40 IC (A) 60 80
VCE = 800V VGE = 15V RG = 5 TJ = 125C
Switching Energy Losses vs Gate Resistance 1.8 1.6 1.4 1.2 1 0.8 0.6 0 10 20 30 Gate resistance (ohms)
VCE = 800V VGE =15V IC = 30A TJ = 125C
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 1.4 Thermal Impedance (C/W) 1.2 1 0.8 0.6 0.4 0.2 0.3 0.1 0.05 0.0001 0.001 Single Pulse 0.9 0.7 0.5
Rectangular Pulse Duration (Seconds)
www.microsemi.com
12 - 13
APTCV60TLM24T3G - Rev 0
October, 2009
0 0.00001
0.01
0.1
1
10
APTCV60TLM24T3G
CR2 & CR3 Typical performance curve
Forward Current vs Forward Voltage 30 IF, Forward Current (A)
TJ=125C
20
TJ=25C
10
0 0 1 2 3 4 VF, Anode to Cathode Voltage (V) Energy losses vs Collector Current Switching Energy Losses vs Gate Resistance 1 0.8 0.6
VCE = 800V VGE = 15V RG = 5 TJ = 125C
1.2 1 0.8 E (mJ) 0.6 0.4 0.2 0 0 5 10 15 IC (A) 20 25 30
E (mJ)
0.4 0.2 0 0
VCE = 800V VGE =15V IC = 15A TJ = 125C
5
10 15 20 25 Gate resistance (ohms)
30
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 2.4 Thermal Impedance (C/W) 2 1.6 1.2 0.8 0.4 0 0.00001 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse
0.01
0.1
1
10
Rectangular Pulse Duration (Seconds)
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
www.microsemi.com
13 - 13
APTCV60TLM24T3G - Rev 0
October, 2009

▲Up To Search▲

Price & Availability of APTCV60TLM24T3G

	To Download APTCV60TLM24T3G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .